Wafer rotation plating machine
Process flow: electroplating
Specifications: R-EP01, Q-EP01
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product specifications
● Applicable product type: 01005 0201 type
● Plating time: 3~4H/batch (according to the process)
● Plating amount: 1KK/batch (according to the manufacturing process)
● Control: Keyence PLC
● Appearance dimensions: length 1720x width 1700x height 1980 (mm) (subject to the actual object) )
Product advantages
● The equipment operates efficiently
● Using centrifugal plating, the plating uniformity is good
● Accurate and stable temperature control system, the plating yield is high
● Products of different specifications can be electroplated, with strong compatibility
● Various electroplating chemicals are circulated through water pipelines, with little chemical pollution
● High Precision control valve and good circulation system, high potion reuse rate
● Stable product quality, high recognition in the industry
● Independent design with invention patent
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Address of Head Office:No. 80, Yuyang Road, Yushan Town, Kunshan City
Mailbox:sales@hopoks.com
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